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No-Clean Soldering Paste Tin Mud Phone Repair Tool SMT Patch Maintenance LED

32 sold
Features: 1.A high viscosity no-clean flux , widely used for PCB , BGA , PGA reworking,soldering and reballing of computer and phone chips . 2.The mixture of high-quality alloyed powder and resinic pasty flux , can avoid the pale yellow residue , easy to clean the board. 3.Joint high intensity,good immersion. 4.Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on. 5.Good insulation,smooth welding surface,good soldering and welding tool. Specifications: Model:XD-Z40 Bottle Color:Multicolor Item size:100 x 27 x 27mm Item Weight: 36g Volume:10ml Package Information: Package Size: 140 x 93 x 15mm/5.51 x 3.66 x 0.59in Package Weight: 37g/1.30oz Polybag Package List: 1 x Soldering Paste