1.A high viscosity no-clean flux , widely used for PCB , BGA , PGA reworking,soldering and reballing of computer and phone chips .
2.The mixture of high-quality alloyed powder and resinic pasty flux , can avoid the pale yellow residue , easy to clean the board.
3.Joint high intensity,good immersion.
4.Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on.
5.Good insulation,smooth welding surface,good soldering and welding tool.
Item size:100 x 27 x 27mm
Item Weight: 36g
Package Size: 140 x 93 x 15mm/5.51 x 3.66 x 0.59in
Package Weight: 37g/1.30oz
1 x Soldering Paste